| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition which has excellent electric characteristics and processability, and especially gives excellent surface smoothness, when forming the interlayer insulating layers of multi-layered printed circuit boards. SOLUTION: This resin composition comprises (A) divinylcyclohexane bisbenzocyclobutene and/or a polymer obtained by polymerizing the divinylcyclohexane bisbenzocyclobutene and (B) a polynorbornene represented by general formula (1) [(l) and (m) are each an integer of 10 to 10,000; R<SP>1</SP>and R<SP>2</SP>are each independently H, a 1 to 12C alkyl, trimethoxysilane group, triethoxysilane group, methacryloxymethyl group, glycidyl ether group, or a phenyl group which may have one or more substituents]. COPYRIGHT: (C)2005,JPO&NCIPI
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