发明名称 |
I/O architecture for integrated circuit package |
摘要 |
A circuit package may include an upper surface of first conductive elements and second conductive elements. The first conductive elements may receive input/output signals from respective conductive elements of an integrated circuit die, and the second conductive elements may receive a first plurality of the input/output signals from respective ones of the first conductive elements. A lower surface of the package may include third conductive elements, the third conductive elements to receive a second plurality of the input/output signals from respective other ones of the first conductive elements.
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申请公布号 |
US2005051906(A1) |
申请公布日期 |
2005.03.10 |
申请号 |
US20030657686 |
申请日期 |
2003.09.08 |
申请人 |
HE JIANQI;LI YUAN-LIANG;WALK MICHAEL |
发明人 |
HE JIANQI;LI YUAN-LIANG;WALK MICHAEL |
分类号 |
H01L23/498;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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