MULTICHIP PACKAGE WITH CENTER PADS AND METHOD FOR MANUFACTURING THE SAME TO PREVENT SHORT CIRCUIT BY ATTACHING WIRING BOARD

摘要

PURPOSE: A multichip package with center pads and a method for manufacturing the same are provided to prevent short circuit between a wire and a semiconductor chip and to stack package structures with solder balls by attaching wiring boards with a plurality of wire patterns on each side of the top of a chip. CONSTITUTION: A center pad type semiconductor chip(130) is attached on a printed circuit board(120). A wiring board(140) is provided with a plurality of wiring patterns, the plurality of wiring patterns attached to the top of the semiconductor chip connect electrically the semiconductor chip with the printed circuit board. An external connection terminal attached on the back surface of the printed circuit board sends an electrical signal to the semiconductor chip.