METHOD FOR TREATING WAFER USING LASER TO PREVENT PARTICLE AND STAIN BY FORMING WATER LAYER IN LASER PROCESS

摘要

PURPOSE: A method for process a wafer using laser is provided to prevent particles and a stain generating in a laser treatment by forming a water membrane on the surface of wafer with deionized water. CONSTITUTION: A water membrane having a predetermined thickness is formed by injecting continuously deionized water parallel to the surface of a wafer. The surface of the wafer is processed by a laser. The water membrane is removed by injecting a deactivation gas on the surface of the wafer. Particles generating in a laser treatment are removed by injecting the deionized water at a predetermined angle to the surface of the wafer.