发明名称 METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT TAPE, AND TAPE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a flexible printed circuit tape including a high quality circuit having a narrow pitch between leads. SOLUTION: The method for manufacturing a flexible printed circuit tape comprises steps for preparing a layered body of a metal layer and a flexible film, for forming a metal layer having a thickness of 1.5-4μm reduced by a first etching process, for applying a photoresist on the metal layer having a reduced thickness and exposing/developing the photoresist with a wiring pattern image to expose the metal in the wiring pattern image, for plating a new metal layer on the metal layer, for removing the photoresist to expose the metal layer having a reduced thickness, and for etching the surface of the layered body in a second etching process until the metal layer having a reduced thickness is removed to form the wiring pattern on the surface of the flexible film layer. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005064074(A) 申请公布日期 2005.03.10
申请号 JP20030208083 申请日期 2003.08.20
申请人 THREE M INNOVATIVE PROPERTIES CO 发明人 SATO HIROKI;OKURA HIROYUKI
分类号 H05K3/06;H01L21/60;H05K3/18;(IPC1-7):H05K3/06 主分类号 H05K3/06
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