| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless plating apparatus and an electroless plating method for reducing dispersion of the plating treatment attributable to inconsistency of plating solution. SOLUTION: When a substrate is treated by discharging treatment solution from a treatment solution discharging part, the lapse of time for the plating solution after the solution temperature is adjusted to a predetermined value is set to be not less than the first time and not exceeding the second predetermined value. The plating treatment can be performed with the plating solution in a consistent state by setting the lapse of time after the solution temperature is adjusted to the predetermined value to be within a certain value, and dispersion of the composition of the plating solution and the film thickness can be reduced. COPYRIGHT: (C)2005,JPO&NCIPI
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