发明名称 COMPONENT MOUNTING EQUIPMENT
摘要 <P>PROBLEM TO BE SOLVED: To reduce a time of an operation for detecting the existence of a substrate fail mark, since there is a fault in a conventional technique wherein a time is also necessary until the operation is completed about all of the respective substrate fail marks when the detection of the existence of the substrate fail mark is performed and the substrate fail mark is detected. <P>SOLUTION: In component mounting equipment, the operation for detecting the existence of each of the substrate fail marks corresponding to a multiple printed substrate is performed when the multiple printed substrate is carried in the equipment simultaneously with the formation of a fail mark table corresponding to each of the multiple printed substrates, and the existence of the substrate fail mark is stored in the formed fail mark table. Concerning the multiple printed substrate which is carried in the component mounting equipment, the fail mark table corresponding to the multiple printed substrate is referred before an electronic component is mounted in each substrate, the electronic component is not mounted in the substrate when the fail mark exists, and electronic component mounting control is performed with reference to the fail mark table corresponding to a succeeding substrate. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005064026(A) 申请公布日期 2005.03.10
申请号 JP20030207273 申请日期 2003.08.12
申请人 JUKI CORP 发明人 TSURUTA TOSHIRO;OZAWA MASATO
分类号 H05K13/02;H05K13/04;H05K13/08 主分类号 H05K13/02
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