| 摘要 |
PROBLEM TO BE SOLVED: To surely surface mount all components to be mounted on a board 2 without a thermal damage. SOLUTION: A mounting plate 3 mounts the board 2 in which the component 1 is disposed, and moves in a reflow furnace. A site 3a of the plate 3 corresponding to a disposing region of a component (a component having a small size and easy to be abruptly raised at its temperature, or a component constituted of a material weak for a heat) 1a having a low heat resistance is thickened to increase a thermal capacity. A site 3b of the plate 3 corresponding to a disposing region of a large-sized component 1b is thinned to reduce its thermal capacity. In the reflow furnace, the site 3a of the plate 3 is smoothed at its temperature raising speed of the component 1a having the low heat resistance due to smoothening of the temperature rising speed. The site 3b of the plate is fastened at the temperature rising speed of the component 1b due to the fastening of the temperature rising speed. Since the component 1a having the low heat resistance is gradually heated, its thermal damage can be prevented. Since the component 1b having the large size is raised at the solder between the component 1b and the board 2 to be surely raised to the melting temperature, the component 2b can be surface mounted on the board 2. COPYRIGHT: (C)2003,JPO |
