| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a solid state imaging device where a translucent plate is easily positioned on the upper end face of a rib 3 constituting a casing, and the casing is miniaturized by reducing the width of the rib after completion. <P>SOLUTION: The casing 1 formed of a substrate 2 and the rib 3 in the shape of a rectangular frame is resin-molded integrally with a plurality of metal lead pieces 9 to form an internal terminal and an external terminal of each metal lead piece. An imaging element 5 is fixed onto the substrate in the internal space of the casing, the electrode of the imaging element and the internal terminals of the respective metal lead pieces are respectively connected with each other, and the translucent plate 7 is bonded to the upper end face of the rib. In order to position the translucent plate 7, a low stage 25b lowered along an inner periphery is formed to form a level difference on the upper end face of the rib, the translucent plate has a size which can be placed on the upper surface of the low stage within the inner area of an inner wall formed at the level difference of the rib. When bonding the translucent plate to the upper end face of the rib after charging an adhesive 28 to the upper face of the low stage, the translucent plate is placed and bonded onto the adhesive on the upper face of the low stage while regulating a position by the inner wall of the level difference and thereafter, a part positioned outside of the level difference of the rib is deleted. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
