发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To adjust a work function of a gate electrode without exerting adverse influences upon properties or the like. SOLUTION: In a manufacturing method for a semiconductor device comprising a first conductive MIS transistor provided in a first region and a second conductive MIS transistor provided in a second region and having a structure comprising a first gate insulating film 102 provided in the first region, a first conducting portion 111 provided on the first gate insulating film, a second gate insulating film 102 provided in the second region, and a second conducting portion 111 provided on the second gate insulating film, the first conducting portion and second conducting portion are formed of the same conducting film, a work function of a bottom of the first conducting portion being equal to a work function of a bottom of the second conducting portion, a third conducting portion 113 is formed on the second conducting portion by a plating method, and varying the work function of the bottom of the second conducting portion by diffusing a metal element contained in the third conducting portion to the second conducting portion. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005064449(A) 申请公布日期 2005.03.10
申请号 JP20030400581 申请日期 2003.11.28
申请人 TOSHIBA CORP 发明人 NAKAJIMA KAZUAKI;SUGURO KYOICHI
分类号 C23C18/16;C25D7/12;H01L21/28;H01L21/288;H01L21/3205;H01L21/8238;H01L23/52;H01L27/092;H01L29/423;H01L29/49;H01L29/78;(IPC1-7):H01L21/823;H01L21/320 主分类号 C23C18/16
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