摘要 |
An integrated circuit package includes an inductance loop formed from a connection of bonding wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed from a first wire which connects a bonding pad on the integrated circuit chip to an I/O pin of the package and a second wire which connects the same bonding pad to the same pin. By forming the inductor loop within the limits of the integrated circuit package, a substantial reduction in space requirements is realized, which, in turn, promotes miniaturization. |
申请人 |
GCT SEMICONDUCTOR, INC.;KOO, YIDO;HUH, HYUNGKI;LEE, KANG YOON;LEE, JEONG-WOO;PARK, JOONBAE;LEE, KYEONGHO |
发明人 |
KOO, YIDO;HUH, HYUNGKI;LEE, KANG YOON;LEE, JEONG-WOO;PARK, JOONBAE;LEE, KYEONGHO |