METHOD OF INSPECTING INFORMATION SETTING ERRORS IN WAFER USING POSITION INFORMATION OF TAG DIE OR EDGE DIE

摘要

PURPOSE: A method of inspecting information setting errors in a wafer is provided to secure the exactness of test results of the wafer and to prevent the degradation of wafer quality by using bits of position information of a tag die or an edge die. CONSTITUTION: A bit of first information is detected from a check die used as a reference die by using a tester. Whether the first information is consistent with a bit of second information of the check die stored in a prober is determined(S230). When the first information and the second information are consistent with each other, a wafer test is performed(S250). In case of the existence of a tag die, one or more check dies adjacent to a normal die exist within a tag die range. Without the tag die, the check die is composed of two or more edge dies adjacent to the normal die.