METHOD FOR ACCOMMODATING SMALL MINIMUM DIE IN WIRE BONDED AREA ARRAY PACKAGES,申请号KR20057001003-传众专利搜索

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发明名称	METHOD FOR ACCOMMODATING SMALL MINIMUM DIE IN WIRE BONDED AREA ARRAY PACKAGES
摘要
申请公布号	KR20050023442(A)	申请公布日期	2005.03.09
申请号	KR20057001003	申请日期	2005.01.19
申请人		发明人
分类号	H01L21/60	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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