发明名称 METHOD OF BONDING SUBSTRATES TO ENHANCE BONDING STRENGTH BY IRRADIATING VARIOUS KINDS OF PARTICLE BEAMS ON SURFACES OF SUBSTRATES AND METHOD FOR IRRADIATING PARTICLE BEAMS THEREON
摘要 PURPOSE: A method of bonding substrates and a method of irradiating particle beams thereon are provided to improve the bonding strength of the substrates by using a plasma irradiation method and a radical irradiation method. CONSTITUTION: A first irradiation process is performed to irradiate oxygen particle beams on a surface of each of first and second substrates(800a,800b). A second irradiation process is performed to irradiate nitrogen particle beams on the surface of each of the first and second substrates, simultaneously with or subsequently to the first irradiation process. A bonding process is performed to bond the substrates to each other. The first irradiation process includes a process for irradiating oxygen plasma. The second irradiation process includes a process for irradiating nitrogen radicals.
申请公布号 KR20050022953(A) 申请公布日期 2005.03.09
申请号 KR20040068233 申请日期 2004.08.28
申请人 AYUMI INDUSTRY CO., LTD.;SUGA TADATOMO 发明人 ABE TOMOYUKI;KIM, TAE HYUN;SUGA TADATOMO
分类号 H01L21/02;H01L21/18;H01L21/20;(IPC1-7):H01L21/20 主分类号 H01L21/02
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