发明名称 |
METHOD OF BONDING SUBSTRATES TO ENHANCE BONDING STRENGTH BY IRRADIATING VARIOUS KINDS OF PARTICLE BEAMS ON SURFACES OF SUBSTRATES AND METHOD FOR IRRADIATING PARTICLE BEAMS THEREON |
摘要 |
PURPOSE: A method of bonding substrates and a method of irradiating particle beams thereon are provided to improve the bonding strength of the substrates by using a plasma irradiation method and a radical irradiation method. CONSTITUTION: A first irradiation process is performed to irradiate oxygen particle beams on a surface of each of first and second substrates(800a,800b). A second irradiation process is performed to irradiate nitrogen particle beams on the surface of each of the first and second substrates, simultaneously with or subsequently to the first irradiation process. A bonding process is performed to bond the substrates to each other. The first irradiation process includes a process for irradiating oxygen plasma. The second irradiation process includes a process for irradiating nitrogen radicals.
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申请公布号 |
KR20050022953(A) |
申请公布日期 |
2005.03.09 |
申请号 |
KR20040068233 |
申请日期 |
2004.08.28 |
申请人 |
AYUMI INDUSTRY CO., LTD.;SUGA TADATOMO |
发明人 |
ABE TOMOYUKI;KIM, TAE HYUN;SUGA TADATOMO |
分类号 |
H01L21/02;H01L21/18;H01L21/20;(IPC1-7):H01L21/20 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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