| 摘要 |
PURPOSE: A tape automated bonding(TAB) package structure having a surface mount type semiconductor product is provided to shorten an interval of process time by mounting a peripheral device like a passive device or inverter as well as an integrated circuit(IC) on TAB tape. CONSTITUTION: A predetermined bump as an electrode is formed in the IC(20) of a semiconductor TAB package structure. A pattern is formed on the TAB tape having the IC and an electrical circuit, namely, polyimide(10) in a tape carrier package(TCP) or chip-on-flex(COF) package by using a copper thin film. A surface mount type semiconductor package is mounted on a predetermined portion of a semiconductor package structure. |
