| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing machine, which separately has a means capable of employing a cluster structure for handling an a clean object such as a semiconductor wafer to be polished and means for handling a dirty object to be polished, and to provide polishing method. SOLUTION: The polishing machine for transporting an object S to be polished therein, polished the object, cleaning the object, and then transporting the clean polished object outside therefrom, includes a cleaning section 15 for cleaning and drying the polished object S. The cleaning section 15 has a rinse part present at a loading position, at which a top ring releases the polished object S, and the rinse part has a mechanism for cleaning the object S. |
