LOW TEMPERATURE SOLDER COLUMN ATTACH BY INJECTION MOLDED SOLDER,申请号KR20010051390-传众专利搜索

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发明名称	LOW TEMPERATURE SOLDER COLUMN ATTACH BY INJECTION MOLDED SOLDER
摘要
申请公布号	KR100470773(B1)	申请公布日期	2005.03.08
申请号	KR20010051390	申请日期	2001.08.24
申请人		发明人
分类号	H05K3/34;B23K3/06;B23K31/02;B23K35/02;B23K35/14;H01L21/48;(IPC1-7):H05K3/34	主分类号	H05K3/34
代理机构		代理人
主权项
地址

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