发明名称 |
Sputtering apparatus and sputter film deposition method |
摘要 |
A sputtering apparatus and a sputter film deposition method, which includes a conventional magnetron and an AC magnetron for deposition of a low refractive index film, and a conventional magnetron and an AC magnetron for deposition of a high refractive index film, performs film deposition by each of the AC magnetrons until having achieved 90% of a designed film thickness, and then performs the film deposition only by each of the conventional magnetrons, and which can control the film thickness with high precision and have excellent productivity.
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申请公布号 |
US6863785(B2) |
申请公布日期 |
2005.03.08 |
申请号 |
US20030635816 |
申请日期 |
2003.08.07 |
申请人 |
ASAHI GLASS COMPANY, LIMITED |
发明人 |
SHIDOJI EIJI;ANDO EIICHI;YAMADA TOMOHIRO;MASHIMO TAKAHIRO |
分类号 |
C23C14/35;C23C14/50;C23C14/54;C23C14/56;G02B1/10;H01J37/34;(IPC1-7):C23C14/35 |
主分类号 |
C23C14/35 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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