Real-time control of chemically-amplified resist processing on wafer

摘要

One aspect of the present invention relates to a system and method for controlling environmental acid scavengers in real time during pattern exposure of a chemically amplified resist-clad wafer. The system includes a semiconductor wafer comprising a chemically amplified resist layer formed over a substrate layer, wherein a first portion of the resist layer has been removed to expose an area of the substrate layer in order to form a probe area; an exposure system programmed to implement an exposure process to transfer a device pattern onto at least a second portion of the resist layer; and a monitoring system adapted to detect chemical signals about the probe area in order to control the integrity of the resist layer during the exposure process. The method involves feeding data back to the on-going exposure process in order to effect an immediate change in the process.