POWER MODULE FLIP CHIP PACKAGE HAVING REDUCED RESISTANCE, REDUCED INDUCTANCE, AND IMPROVED RELIABILITY

摘要

PURPOSE: A power module flip chip package is provided to reduce a resistance and inductance, and improve reliability by connecting a power semiconductor device to a package substrate by a flip-chip method. CONSTITUTION: A package carrier(110) includes a front side(110F) and a back side(110B) opposite to the front side. A plurality of conductive bumps(BG,BS,BD) are formed on the front side of the package carrier. A power semiconductor device(120) is electrically connected to the package carrier through the conductive bumps. The conductive bumps are electrically connected to a gate terminal, a source terminal, and a drain terminal of the power semiconductor device.