发明名称 |
Alignment mark for aligning wafer of semiconductor device |
摘要 |
The present invention relates to an alignment mark for use in a wafer alignment and a method for fabricating the same. The alignment mark for use in the wafer alignment includes: a first mark formed on a semiconductor layer; a second mark formed adjacent to the first mark on the semiconductor layer; and a concave part formed between the first mark and the second mark by etching a partial portion of the semiconductor layer, wherein the alignment mark is used to align a wafer by detecting a zeroth order diffract light reflected from a sloped surface formed because of a difference in height between the concave part and the first or second mark.
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申请公布号 |
US6864590(B2) |
申请公布日期 |
2005.03.08 |
申请号 |
US20030743715 |
申请日期 |
2003.12.24 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
BAE SANG-MAN;KIM HYEONG-SOO |
分类号 |
H01L21/027;G01D21/00;H01L23/544;(IPC1-7):H01L23/544 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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