发明名称 |
Bump and fabricating process thereof |
摘要 |
A bump structure on a contact pad and a fabricating process thereof. The bump comprises an under-ball-metallurgy layer, a bonding mass and a welding lump. The under-ball-metallurgy layer is formed over the contact pad and the bonding mass is formed over the under-ball-metallurgy layer by conducting a pressure bonding process. The bonding mass having a thickness between 4 to 10 mum is made from a material such as copper. The welding lump is formed over the bonding mass such that a sidewall of the bonding mass is also enclosed. |
申请公布号 |
US6864168(B2) |
申请公布日期 |
2005.03.08 |
申请号 |
US20030604792 |
申请日期 |
2003.08.18 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
CHEN WILLIAM TZE-YOU;TONG HO-MING;LEE CHUN-CHI;TAO SU;CHANG CHIH-HUANG;WU JENG-DA;HUANG WEN-PIN;CHENG PO-JEN |
分类号 |
H01L21/60;H01L23/485;(IPC1-7):H01L21/447 |
主分类号 |
H01L21/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|