| 摘要 |
A manufacturing method for a COF semiconductor device according to the present invention comprises:Step (A) of applying an insulating resin composition to a surface of an insulating tape on the surface of which a plurality of wiring patterns is arranged;Step (B) of pressably contacting a semiconductor element to the wiring patterns in the condition wherein the insulating resin composition is not yet cured; andStep (C) of fixing the semiconductor element to the wiring patterns so as to be electrically connected by curing the insulating resin composition, whereinthe manufacturing method for a COF semiconductor device further includes Step (D) of pre-heating the insulating tape from the rear surface side before, during, and/or after the application of the insulating resin composition.
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