发明名称 METHOD OF MANUFACTURING TRANSISTOR CAPABLE OF MINIMIZING THERMAL PROCESS AND RESTRAINING DIFFUSION OF THERMIONS TO REDUCE JUNCTION LEAKAGE CURRENT
摘要 PURPOSE: A method of manufacturing a transistor is provided to prevent diffusion of channel control impurities and reduce a PN junction area by minimizing a thermal process after an impurity implantation process for controlling a channel. CONSTITUTION: A dummy gate electrode and a top insulating layer for dummy gate are formed on a semiconductor substrate(100). A first impurity region(116) is formed on a source/drain region of both sides of the dummy gate electrode. A spacer(118) is formed on a sidewall of the dummy gate electrode. A second impurity region(120) is formed by using the spacer as an ion implantation mask. A pad polysilicon layer(124) is formed on the source/drain region. A thermal process for the semiconductor substrate is performed. A third impurity region(126) is formed on a gate region. A gate electrode is formed on the gate region by removing the dummy gate oxide layer and inserting a gate insulating layer therein.
申请公布号 KR20050022699(A) 申请公布日期 2005.03.08
申请号 KR20030060331 申请日期 2003.08.29
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOE, JEONG DONG;HAN, SANG YEON;JIN, GYO YOUNG;PARK, DONG GUN;YOSHIDA, MAKOTO;YOUN, JAE MAN
分类号 H01L21/334;H01L21/336;H01L21/8234;H01L21/8238;(IPC1-7):H01L21/334 主分类号 H01L21/334
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