BGA PACKAGE, METHOD OF MANUFACTURING THE SAME FOR REDUCING FABRICATION COST AND SIMPLIFYING MANUFACTURING PROCESSES, AND STACKED STRUCTURE OF BGA PACKAGE

摘要

PURPOSE: A BGA(Ball Grid Array) package, a manufacturing method thereof and a stacked structure of BGA package are provided to simplify remarkably manufacturing processes and to economize fabrication cost by attaching solder balls to a semiconductor chip before an encapsulation process. CONSTITUTION: A BGA package includes a substrate(220), a semiconductor chip(200) on the substrate, a plurality of solder balls(260) on the chip, and an encapsulating member. The encapsulating member(280) is used for enclosing the chip except solder balls. A bonding wire(270) connects the chip with the substrate within the encapsulating member.