发明名称 Method for mounting electronic component
摘要 A parts mounting method employing a suction section having a plurality of suction nozzles is provided. The suction section is moved to a parts supply section in which a plurality of parts are suctioned by the suction nozzles at the same time. The parts are then mounted onto a board. The suction nozzles are divided into groups: a first group having a shift amount within an allowable range in which simultaneous suction is possible; and a second group having a shift amount outside the allowable range in which simultaneous suction is possible. The parts are then sucked at the same time for each of the groups.
申请公布号 US6862803(B2) 申请公布日期 2005.03.08
申请号 US20010940743 申请日期 2001.08.28
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 KAWASE TAKEYUKI;SHIMIZU JUNKEI;UCHIYAMA HIROSHI;YOSHIDA NORIAKI
分类号 H05K13/04;H05K13/08;(IPC1-7):H05K3/30 主分类号 H05K13/04
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