| 摘要 |
An apparatus for polishing an object, includes (a) a rotatable circular polishing plate (11) having a polishing surface on which an object (12) is to be polished, (b) a pressurizer (21) which applies a pressure to an object (12) to make the object (12) contact with the polishing surface, (c) a first unit (13) which supplies polishing solution containing abrasive, to the polishing surface, (d) a dresser (23) which dresses the polishing surface, and (e) a second unit (14) which is located downstream of the dresser (23) and upstream of the first unit (13) in a direction of rotation of the polishing plate (11) and which has an absorption surface (31) through which the second unit sucks the polishing solution from the polishing surface, the absorption surface (31) being formed thereon with a plurality of pivots (35). |
