发明名称 Semiconductor device having active regions connected together by interconnect layer and method of manufacture thereof
摘要 A semiconductor device having active regions connected by an interconnect line, which includes first and second transistors each having active regions and formed spaced apart from each other in a semiconductor substrate, an isolation region for isolating the first and second transistors from each other, a slit formed in the isolation region to allow those paired active regions of the first and second transistors which are opposed to each other with the isolation region interposed therebetween to communicate with each other through it, a conductive film formed on the inner walls of the slit, and an interconnect layer having first and second portions, each of which is electrically connected with a corresponding one of the paired active regions, and a third portion which is formed along the slit on the isolation region to connect the first and second portions with each other.
申请公布号 US6864544(B2) 申请公布日期 2005.03.08
申请号 US20020083163 申请日期 2002.02.27
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 HOKAZONO AKIRA
分类号 H01L21/28;H01L21/3205;H01L21/76;H01L21/762;H01L21/768;H01L21/8234;H01L21/8238;H01L21/8244;H01L23/52;H01L23/522;H01L27/08;H01L27/088;H01L27/092;H01L27/11;(IPC1-7):H01L29/06 主分类号 H01L21/28
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