| 摘要 |
A configuration including a grounding mechanism protects a semiconductor device from electrical overstress damage during processes, such as an RIE process, where an electrical charge can build up on the semiconductor device. According to an exemplary embodiment, the configuration secures a semiconductor device such that a die of the device is exposed to an electrically charged environment and electrically conductive terminals of the device are isolated from the electrically charged environment. The grounding mechanism electrically connects each of the electrically conductive terminals to a ground potential while the die is exposed to the electrically charged environment.
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