发明名称 Multi-stage interconnect architecture for complex programmable logic devices
摘要 Systems and methods are disclosed for providing a multi-stage interconnect architecture, such as for high density and high performance complex programmable logic devices. As an example, a first stage of a two-stage interconnect architecture programmably routes signals from a global routing structure to a second stage of the two-stage interconnect architecture. The second stage routes signals from the first stage to a number of logic blocks. The second stage also-optionally routes feedback signals from the logic blocks along with signals from associated I/O terminals back to the logic blocks to provide local feedback capability.
申请公布号 US6864713(B1) 申请公布日期 2005.03.08
申请号 US20030428888 申请日期 2003.05.01
申请人 发明人
分类号 H03K19/177;(IPC1-7):H03K19/177 主分类号 H03K19/177
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