发明名称 |
Wire bonding process and wire bond structure |
摘要 |
In a wire-bonding process, a chip is provided with at least a first contact pad. A chip carrier is further provided with at least a second contact pad. A plurality of stacked conductive bumps are formed on the first contact pad. A conductive wire is formed by a reverse bonding process. The conductive wire electrically connects the second contact pad of the chip carrier to the stacked conductive bumps over the first contact pad of the chip.
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申请公布号 |
US6863208(B2) |
申请公布日期 |
2005.03.08 |
申请号 |
US20020335350 |
申请日期 |
2002.12.31 |
申请人 |
ADVANCED SEMICONDUCTOR ENIGNEERING, INC. |
发明人 |
LEE CHUN-CHI |
分类号 |
B23K20/00;(IPC1-7):B23K31/00;B23K31/02 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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