发明名称 |
RADIATION FIN ASSEMBLY STRUCTURE FOR ELECTRONIC CHIP COOLING DEVICE, CAPABLE OF ACCOMPLISHING EASE OF ASSEMBLY BY ASSEMBLING RADIATION FINS HAVING THROUGH HOLES THROUGH FIXING MEMBER |
摘要 |
PURPOSE: A radiation fin assembly structure is provided to allow for ease of assembly by assembling radiation fins and forming a radiation block through the use of a bending scheme employing a fixing member. CONSTITUTION: An electronic chip cooling device comprises a radiation block(140) constituted by a plurality of radiation fins(141) for emitting heat generated from an electronic chip; and a fan motor for compulsorily blowing a cooling fluid to the radiation block. The radiation block includes radiation fins and at least one fixing member(143). Each of the radiation fins has at least one through hole(141c). The fixing member penetrates the through holes of the radiation fins such that the fixing member prevents the radiation fins from escaping, to thereby connect the radiation fins into the radiation block.
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申请公布号 |
KR20050021603(A) |
申请公布日期 |
2005.03.07 |
申请号 |
KR20030057221 |
申请日期 |
2003.08.19 |
申请人 |
LG INNOTEC CO., LTD. |
发明人 |
KIM, HO SUNG |
分类号 |
H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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