发明名称 METHOD FOR SEPARATING UV-BONDED STRUCTURE TO MORE EASILY SEPARATE UV-BONDED STRUCTURE AND REDUCE DEFECTIVE PROPORTION
摘要 PURPOSE: A method for separating a UV(ultraviolet)-bonded structure is provided to more easily separate a UV-bonded structure by eliminating UV adhesive after the UV adhesive is hardened, and to reduce defective proportion by preventing an object to be adhered from being damaged. CONSTITUTION: At least one structure to be bonded is coupled(S10). A heat coil of a predetermined shape is located between the coupled structures to be hardened by adhesive(S20). Adhesive is injected to a gap between the structures having the heat coil(S30). The matching position of the structure is adjusted, and UV is irradiated to harden the adhesive(S40). Whether the matching of the hardened structure is normal is determined(S60). When the matching of the hardened structure is determined to be abnormal as a result of the determination, current is applied to the heat coil and heat is generated from the heat coil to eliminate the adhesive(S70,S80). The abovementioned processes are repeated until the matching the structure becomes normal.
申请公布号 KR20050022210(A) 申请公布日期 2005.03.07
申请号 KR20030058797 申请日期 2003.08.25
申请人 LG ELECTRONICS INC. 发明人 LEE, SANG KEUN;SONG, JIN HAN
分类号 H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/60
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