发明名称 HYGROSCOPIC MOLDING
摘要 The present invention provides a moisture-absorbent formed body comprising 1) an amine compound and/or a thermally conductive material, 2) a hygroscopic agent, and 3) a resin component, for removing moisture from within the sealed atmosphere of an organic electroluminescent device, and thereby suppressing the occurrence of dark spots. <IMAGE>
申请公布号 KR20050021448(A) 申请公布日期 2005.03.07
申请号 KR20057000386 申请日期 2003.07.07
申请人 发明人
分类号 H05B33/04;H01L23/26;H01L51/52 主分类号 H05B33/04
代理机构 代理人
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