发明名称 METHOD AND APPARATUS FOR CLEANING AND DRYING SUBSTRATE HOLDING CHUCK TO IMPROVE THROUGHPUT OF WHOLE APPARATUS AND SHORTEN INTERVAL OF TIME FOR CLEANING AND DRYING SUBSTRATE HOLDING CHUCK
摘要 PURPOSE: An apparatus for cleaning and drying a substrate holding chuck is provided to improve throughput of a whole apparatus and shorten an interval of time for cleaning and drying a substrate holding chuck by making the second fluid supply nozzle inject a cleaning solution together with gas toward the holding groove of a holding member prior to a cleaning solution supply nozzle. CONSTITUTION: The second fluid supply nozzle injects a cleaning solution together with gas toward the holding groove(31a,32a,33a) of a holding member(34). A cleaning solution supply nozzle injects a cleaning solution toward the side surface of the holding member. A transfer unit relatively transfers the second fluid supply nozzle, the cleaning solution supply nozzle and the holding member in the length direction of the holding member. The second fluid supply nozzle injects a cleaning solution together with gas toward the holding groove of the holding member prior to a cleaning solution supply nozzle by driving the transfer unit.
申请公布号 KR20050021238(A) 申请公布日期 2005.03.07
申请号 KR20040065530 申请日期 2004.08.19
申请人 TOKYO ELECTRON LIMITED 发明人 OHTSUKA HIROMI
分类号 H01L21/677;B08B3/02;H01L21/00;H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/677
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