发明名称 ELECTRIC CIRCUIT BOARD WITH INSULATING FILM NOT OVERLAPPED BY ELECTRODE PADS
摘要 PURPOSE: An electric circuit board is provided to form electrode pads smaller than openings of an insulating film in a plane surface direction for improving the flatness of the insulating film. CONSTITUTION: An electric circuit board includes an insulating substrate(11), and an insulating film(23) formed on the substrate. Wires are formed on the substrate and connected to electrode pads(21) formed of conductive materials connected to external connection terminals. The insulating film is formed with openings for exposing the electrode pads upward. The electrode pads are smaller than the openings at corresponding positions not to overlap the insulating film by the electrode pads, so that a clearance(26) is formed between each of the electrode pads and each of the openings.
申请公布号 KR20050020708(A) 申请公布日期 2005.03.04
申请号 KR20040065921 申请日期 2004.08.20
申请人 SONY CORPORATION 发明人 TORIYAMA SHIGETAKA
分类号 G02F1/1343;G02F1/13;G02F1/1345;G09F9/00;G09F9/30;H01L21/60;H01L23/498;H05K1/03;H05K3/40;(IPC1-7):G02F1/134 主分类号 G02F1/1343
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