发明名称 Tape carrier package.
摘要 The invention provides a tape carrier package. An integrated circuit element has a free edge that is not provided with electrodes. A flexible film defines a device hole that is smaller than the integrated circuit element and in which the electrodes of the integrated circuit element are disposed. A plurality of leads are provided on the flexible film and connected to the electrodes through the device hole. At least one flow control member is disposed between the integrated circuit element and the flexible film. The flow control member controls a flow of a resin along the free edge of the integrated circuit element.
申请公布号 HK1015949(A1) 申请公布日期 2005.03.04
申请号 HK19990100929 申请日期 1999.03.08
申请人 SEIKO EPSON CORPORATION 发明人 YOSHIKAZU FUJIMORI
分类号 H01L21/60;H01L23/28;H01L23/495 主分类号 H01L21/60
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