| 摘要 |
PURPOSE: A stack package with area array type semiconductor packages and a manufacturing method thereof are provided to improve remarkably electrical properties and to reduce the whole height of the stack package by enhancing an interconnection structure using a flexible cable. CONSTITUTION: A stack package(300) includes a substrate(302), a semiconductor chip(301) on the substrate, a plurality of external connection terminal pads under the substrate, first wiring for connecting electrically the chip and the external connection terminal pad with each other, a plurality of connecting pads under the substrate, second wiring for connecting electrically the chip and the connecting pad with each other, and a flexible cable with a conductor pattern. The flexible cable(306) is used for connecting area array type semiconductor packages with each other. |
