发明名称 |
WAFER TRANSPORTATION SYSTEM OF HEAT TREATMENT EQUIPMENT HAVING SIMPLIFIED STRUCTURE TO REDUCE WAFER TRANSFER SECTION AND NUMBER OF COMPONENTS TO TRANSFER WAFER |
摘要 |
PURPOSE: A wafer transportation system of heat treatment equipment is provided to reduce a wafer transfer section and transfer rapidly a wafer by forming the wafer transportation system with a carrier input/output part, a carrier station, and a wafer transfer. CONSTITUTION: A carrier input/output part(40) is provided to locate a carrier by aligning and supporting a sequentially loaded carrier. A carrier station(50) is selectively rotated to load or unload the carrier received from the carrier input/output part(40) according to a rotating position thereof. A wafer transfer is provided to transfer a wafer between the carrier and a boat, which are loaded on a carrier stage.
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申请公布号 |
KR20050020128(A) |
申请公布日期 |
2005.03.04 |
申请号 |
KR20030057839 |
申请日期 |
2003.08.21 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LIM, YOUNG CHUL |
分类号 |
H01L21/324;(IPC1-7):H01L21/324 |
主分类号 |
H01L21/324 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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