发明名称 WAFER TRANSPORTATION SYSTEM OF HEAT TREATMENT EQUIPMENT HAVING SIMPLIFIED STRUCTURE TO REDUCE WAFER TRANSFER SECTION AND NUMBER OF COMPONENTS TO TRANSFER WAFER
摘要 PURPOSE: A wafer transportation system of heat treatment equipment is provided to reduce a wafer transfer section and transfer rapidly a wafer by forming the wafer transportation system with a carrier input/output part, a carrier station, and a wafer transfer. CONSTITUTION: A carrier input/output part(40) is provided to locate a carrier by aligning and supporting a sequentially loaded carrier. A carrier station(50) is selectively rotated to load or unload the carrier received from the carrier input/output part(40) according to a rotating position thereof. A wafer transfer is provided to transfer a wafer between the carrier and a boat, which are loaded on a carrier stage.
申请公布号 KR20050020128(A) 申请公布日期 2005.03.04
申请号 KR20030057839 申请日期 2003.08.21
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LIM, YOUNG CHUL
分类号 H01L21/324;(IPC1-7):H01L21/324 主分类号 H01L21/324
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