发明名称 |
METHOD OF ATTACHING SOLDER BALL TO SEMICONDUCTOR PACKAGE WITHOUT DETACHMENT USING BALL BUMP OR WIRE LOOP AND SEMICONDUCTOR PACKAGE MANUFACTURED THEREBY |
摘要 |
PURPOSE: A method of attaching a solder ball to a semiconductor package and the semiconductor package manufactured thereby are provided to improve the intensity of attachment of a solder ball by embedding a ball bump or a wire loop connected with a solder ball land into the solder ball. CONSTITUTION: Solder ball lands(12) of a substrate(11) are exposed to the outside by using a solder mask(13) with a predetermined pattern. A gold ball(22a) is attached on each solder ball land by using wire-bonding. By cutting a gold wire(21a) connected with the gold ball, a plurality of ball bumps are formed on the solder ball land. A flux is coated on the solder ball land. A ball bump embedded in solder ball(15) is formed on the solder ball land by using a re-flow manner. |
申请公布号 |
KR20050020375(A) |
申请公布日期 |
2005.03.04 |
申请号 |
KR20030058275 |
申请日期 |
2003.08.22 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LIM, WON CHUL;YANG, SUN MO |
分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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