INTERCONNECTION BOARD FOR NSMD-TYPE BGA PACKAGE AND FABRICATING METHOD THEREOF TO AVOID CRACK IN PATTERN

摘要

PURPOSE: An interconnection board for an NSMD(non solder mask defined)-type BGA(ball grid array) package is provided to avoid a crack in a pattern by reducing concentration of stress on an interface between an interconnection pattern and a solder mask. CONSTITUTION: A body of a board is prepared. An interconnection pattern(70) of a copper material is formed on a surface of the body of the board, including a solder ball pad(72) and a connection pattern(74) connected to the solder ball pad. The first solder mask is formed on a surface of the body of the board, including the first open part(81) to which a part of the solder ball pad and the connection pattern broader than the substantial open part of the solder ball pad is exposed. A plating layer is formed on the solder ball pad and the connection pattern exposed to the first open part. The first solder mask is covered with the second solder mask(84) including the second opening part that corresponds to the substantial open part of the solder ball pad and is narrower than the first open part, wherein a part of the solder ball pad and the connection pattern is exposed to the second open part(83). The interfacial surface of the first open part is protected by the second solder mask.