| 摘要 |
PROBLEM TO BE SOLVED: To materialize easy resin demolding without needing galvanization, electrocasting, etc., in order to transfer a minute uneven shape of a high aspect ratio or a smooth surface and the transfer molding of the minute uneven shape. SOLUTION: The surface of a silicon substrate having the minute uneven shape of the high aspect ratio is made hydrophilic and used as a transfer mold. After a resin is applied on the surface of the transfer mold and hardened, a resin part is peeled off from the transfer mold, for example, by immersing the resin part in a hot water, so that the resin of the minute uneven shape of the high aspect ratio or the smooth processing surface can be transfer-molded. COPYRIGHT: (C)2005,JPO&NCIPI
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