发明名称 |
Surface acoustic wave device and method for manufacturing the same |
摘要 |
A surface acoustic wave device includes a piezoelectric substrate, an interdigital transducer (IDT) electrode, and a connecting portion that is electrically connected with the IDT electrode. The surface acoustic wave device further includes a wiring portion, a portion of which is disposed on the connecting portion, and a bump disposed on the wiring portion. The connecting portion includes a comb-shaped portion at an end of the connecting portion on which the wiring portion is disposed.
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申请公布号 |
US2005046307(A1) |
申请公布日期 |
2005.03.03 |
申请号 |
US20040922032 |
申请日期 |
2004.08.19 |
申请人 |
SAKAGUCHI KENJI;AKIYAMA KENJI |
发明人 |
SAKAGUCHI KENJI;AKIYAMA KENJI |
分类号 |
H03H9/25;H03H3/08;H03H9/05;H03H9/145;(IPC1-7):H03H9/25 |
主分类号 |
H03H9/25 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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