发明名称 Surface acoustic wave device and method for manufacturing the same
摘要 A surface acoustic wave device includes a piezoelectric substrate, an interdigital transducer (IDT) electrode, and a connecting portion that is electrically connected with the IDT electrode. The surface acoustic wave device further includes a wiring portion, a portion of which is disposed on the connecting portion, and a bump disposed on the wiring portion. The connecting portion includes a comb-shaped portion at an end of the connecting portion on which the wiring portion is disposed.
申请公布号 US2005046307(A1) 申请公布日期 2005.03.03
申请号 US20040922032 申请日期 2004.08.19
申请人 SAKAGUCHI KENJI;AKIYAMA KENJI 发明人 SAKAGUCHI KENJI;AKIYAMA KENJI
分类号 H03H9/25;H03H3/08;H03H9/05;H03H9/145;(IPC1-7):H03H9/25 主分类号 H03H9/25
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