发明名称 |
Diffusion solder position, and process for producing it |
摘要 |
A diffusion solder position between two parts has intermetallic phases formed by two solder components. Nanoparticles of a filler material are three-dimensionally distributed in its diffusion region in addition to the intermetallic phases. Furthermore, a process for producing the diffusion solder position and for producing an electronic power component, which has a plurality of diffusion solder positions, is provided. |
申请公布号 |
US2005048758(A1) |
申请公布日期 |
2005.03.03 |
申请号 |
US20040927621 |
申请日期 |
2004.08.27 |
申请人 |
HOSSEINI KHALIL;RIEDL EDMUND |
发明人 |
HOSSEINI KHALIL;RIEDL EDMUND |
分类号 |
B23K1/00;B23K1/20;B23K35/02;B23K35/14;B23K35/26;B23K35/30;H01L21/60;(IPC1-7):H01L21/44 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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