发明名称 Diffusion solder position, and process for producing it
摘要 A diffusion solder position between two parts has intermetallic phases formed by two solder components. Nanoparticles of a filler material are three-dimensionally distributed in its diffusion region in addition to the intermetallic phases. Furthermore, a process for producing the diffusion solder position and for producing an electronic power component, which has a plurality of diffusion solder positions, is provided.
申请公布号 US2005048758(A1) 申请公布日期 2005.03.03
申请号 US20040927621 申请日期 2004.08.27
申请人 HOSSEINI KHALIL;RIEDL EDMUND 发明人 HOSSEINI KHALIL;RIEDL EDMUND
分类号 B23K1/00;B23K1/20;B23K35/02;B23K35/14;B23K35/26;B23K35/30;H01L21/60;(IPC1-7):H01L21/44 主分类号 B23K1/00
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