| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flip-chip architecture semiconductor light emitting device such as a light emitting diode. <P>SOLUTION: The device includes a submount, and a semiconductor light emitting device which is mounted on a first and a second conductive region on a first side of the submount in a flip chip architecture configuration. The submount has a third and a fourth conductive region on a second side of the submount. The third and fourth conductive regions may be used to solder the submount to a structure such as a substrate, without wire bonding. The first and third conductive regions are electrically connected by a first conductive layer, and the second and fourth conductive regions are electrically connected by a second conductive layer. The first and second conductive layers may be disposed on the outside of the submount or within the submount. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
