SOLID-STATE IMAGE PICKUP DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method by which a highly reliable solid-state image pickup device can be manufactured easily.

SOLUTION: The solid-state image pickup device comprises a semiconductor substrate 100 on which a plurality of solid-state image pickup elements is formed, a light-transmissive member 200 mounted on the surface of the substrate 100 so that the member 200 may have voids correspondingly to the light receiving regions of the solid-state image pickup elements, and external connecting terminals connected to the solid-state image pickup elements formed on the substrate 100. Distances from the surfaces of the light receiving regions to the surface of the light-transmissive member 200 are adjusted to≥0.5 mm. The method of manufacturing the solid-state image pickup device includes: a step of forming the plurality of solid-state image pickup elements on the surface of the semiconductor substrate 100; a step of joining the light-transmissive member 200 to the surface of the substrate 100 so that the member 200 may have the voids correspondingly to the light receiving regions of the solid-state image pickup elements; and a step of dividing the junction body obtained in the joining step into individual solid-state image pickup elements.

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