| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for flexible printed wiring excellent in peeling characteristics, solvent resistance, flame retardancy, migration property and soldering heat resistance, and an adhesive composition used for the manufacture of the substrate. SOLUTION: The adhesive composition comprises (A) a polyester resin, (B) a non-halogen epoxy resin, (C) a curing agent, (D) a phosphazene compound and (E) an inorganic filler, where the ratio of the phosphorus element to the whole organic resin component is 1.8-5.0 wt% and the ratio of the component (E), that is, the inorganic filler to the whole organic resin component is 1-60 wt%. The substrate for flexible printed wiring comprises an electric-insulating film layer and a metal foil layer laminated on the film layer by the adhesive composition. COPYRIGHT: (C)2005,JPO&NCIPI |
