| 摘要 |
PROBLEM TO BE SOLVED: To provide a shock resistance testing method for a wafer which can easily detect a semiconductor wafer having higher possibility for damage in a semiconductor device manufacturing process, and also to provide a method of manufacturing a semiconductor device including the testing process by the same testing method. SOLUTION: A semiconductor wafer is placed on a supporting base with the end extruded from the base and a shock is applied to the end of the semiconductor wafer for the predetermined number of times in predetermined shock acceleration from the lower side (for example, 3 to 7 times in the shock acceleration of 1.5 to 70G). In this case, the shock resistance of the semiconductor wafer is evaluated from the condition of the damage of the wafer. COPYRIGHT: (C)2005,JPO&NCIPI
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