发明名称 |
Method and system for integrated circuit packaging |
摘要 |
According to one embodiment of the invention, a system for packaging integrated circuits includes a mold tool for packaging integrated circuits. The mold tool includes a first mold plate that includes a first non-planar surface and a second mold plate that includes a second non-planar surface. The first and second non-planar surfaces form upper and lower surfaces of a mold cavity when the first and second mold plates are engaged. The mold tool also includes a distribution system coupled to the mold cavity. The distribution system transfers a mold compound into the mold cavity to substantially encapsulate an integrated circuit. The distribution system includes a gate runner coupled to the mold cavity. The gate runner funnels the mold compound into the mold cavity. The distribution system also includes a bridge insert that decreases wear on the gate runner as the mold compound is transferred through the gate runner. |
申请公布号 |
US2005046079(A1) |
申请公布日期 |
2005.03.03 |
申请号 |
US20030648964 |
申请日期 |
2003.08.27 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
MURUGAN SELVARAJAN |
分类号 |
B29C45/02;B29C45/14;B29C45/27;H01L21/56;(IPC1-7):B29C45/14 |
主分类号 |
B29C45/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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