SEMICONDUCTOR LIGHT-EMITTING DEVICE MOUNTING MEMBER, LIGHT-EMITTING DIODE CONSTITUTING MEMBER USING SAME, AND LIGHT-EMITTING DIODE USING SAME

摘要

Disclosed is a semiconductor light-emitting device mounting member (BL) wherein electrode layers for connection (41, 42) are formed on a major surface (10) of a high heat dissipating member (1), thereby forming a device-mounting region (10a) on the major surface (10), and a ridge (2) is so formed as to surround the device-mounting region (10a). The area of the device-mounting region (10a) is 1.05-4 times as large as the area of a semiconductor light-emitting device (LE1). A light-emitting diode constituting member (LE2) is formed by mounting the semiconductor light-emitting device (LE1) on the device-mounting region (10a) of the semiconductor light-emitting device mounting member (BL) and filling the space inside the ridge (2) with a phosphor and/or a protective resin (LR). A light-emitting diode (LE3) is obtained by mounting the light-emitting diode constituting member (LE2) in a package (7).